PATENTED: No. 10-1436553/Korea for a "new method of manufacturing semiconductor device & equipment for through-silicon-via structure".
Breakthrough Technology in Semiconductor Industry Manufacturing
Breakthrough Technology in Semiconductor Industry Manufacturing
PATENTED: No. 10-1436553/Korea for a "new method of manufacturing semiconductor device & equipment for through-silicon-via structure".
LEARN ABOUT THE TFIS INVESTMENT OPPORTUNITY
Typical TSV Application
CURRENT LIMITATIONS & PROBLEMS OF TSV
TSV application for Wide I/O memory details

The TSV process performance of 3DIC to be affected by metal (conductor & barrier) capability but poor Step Coverage of Copper layer related made it worse and PVD CoO is really high for now. 
Poor Step Coverage (now less than 5% by PVD required more than 50%), low throughput, high CoO (Cost of Ownership)
TSV Dry Process Limitations,
Demand a Different Approach

So PVD came to process limitation and market required new solutions to deposit metal in TSV device of 3DIC.
TFI’s new process and proprietary equipment overcomes major issues and problems of current PVD, sputtering process and equipment limitations.
Time for TSV 3D is Now!
TFI’s new process and proprietary equipment overcomes major issues and problems of current PVD, sputtering process and equipment limitations.
Time for TSV 3D is Now!
NEW ALL WET METAL PROCESS
New Deposition Technology
  • Good step coverage: over 50%
  • ​Available for High Aspect Ratio : > 10:1
  • ​Conformal metal layer deposition and stability
  • Low Capex, high efficiency, reasonable CoO
  • ​Provide in-cluster tool for wet metal process
THE TFI COMPANY

Ty (Tae Young)
Lee

FOUNDER, PRESIDENT & CHAIRMAN OF THE BOARD

YW(Yong Wook), Song

VP & CTO

Winston(Wan Soo), Ra

VP, SALES & MARKETING

YT(Youn Tak), Park

COO & BOARD

Steve Lerner 

TECHNOLOGY ADVISOR & SUPPORT USA SALES

Claudio Truzzi Ph.D

TECHNOLOGY ADVISORY & SUPPORT EUROPEAN SALES

Lisa (Sang Ah), Lee

CORPORATE SECRETARY & BOARD

Agnes (Yea Ok), Kim

CORPORATE TREASURE & BOARD

Ty (Tae Young)
Lee

FOUNDER, PRESIDENT & CHAIRMAN OF THE BOARD

YW(Yong Wook), Song

VP & CTO

Winston(Wan Soo), Ra

VP, SALES & MARKETING

YT(Youn Tak), Park

COO & BOARD

Steve Lerner 

TECHNOLOGY ADVISOR & SUPPORT USA SALES

Claudio Truzzi Ph.D

TECHNOLOGY ADVISORY & SUPPORT EUROPEAN SALES

Lisa (Sang Ah), Lee

CORPORATE SECRETARY & BOARD

Agnes (Yea Ok), Kim

CORPORATE TREASURE & BOARD





2019 Copyright. TFI.
All Rights Reserved.
South Korea Headquarters
#408, Daewoo Frontier Valley 1
1030 Jung-dong, Giheung, Yongin,
Gyeonggi-do, South Korea 17015
Tel.010-5473-5171 tylee@tfitec.com

USA Headquarters
2828 Cochran St. #177
Simi Valley, CA 93065
Tel.+82-10-5473-5171
tfi@tfitec.com

South Korea Headquarters
#408, Daewoo Frontier Valley 1
1030 Jung-dong, Giheung, Yongin,
Gyeonggi-do, South Korea 17015
Tel.010-5473-5171 tylee@tfitec.com

USA Headquarters
2828 Cochran St. #177
Simi Valley, CA 93065
Tel.+82-10-5473-5171
tfi@tfitec.com






2019 Copyright. TFI.
All Rights Reserved.